Polyera Raises USD 24.5MM in Series C Financing
April 5, 2012 -- Polyera, a technology company pioneering next-generation semiconductor technologies for applications ranging from flexible displays to building-integrated solar panels, announced today that it has secured $24.5MM in Series C funding. The round was co-led by Chengwei Capital and Tsing Capital, and was joined by all existing investors including Solvay, an international group active in chemistry. The company plans to use the funds to accelerate development activities while making a major investment in its Asia-Pacific operations in preparation for market launch.
Polyera's core technology enables the fabrication of semiconductor-based products on flexible substrates such as plastic. As a result, products such as flat panel displays or solar panels which were traditionally manufactured with glass can be made much lighter, thinner and more robust. Because Polyera's semiconductor materials are truly flexible themselves, they enable the production of displays that can fold or roll-up, allowing for radically new product designs.